Category:Packages

Package refers to the container/shape/ and size of an IC. The most common type of packaging is DIP. DIP ICs plug directly into breadboard, so they are great for prototyping, but because of their large size, and not very suitable production electronics.

Most packages are surface mount meaning they do not require holes in the circuit board, therefore requiring less space. But without an adapter, can usually not be used on breadboard prototypes.

Common Packages
 * DIP
 * SSOP
 * QFP
 * TO-92
 * TO-3
 * TO-220
 * SOIC
 * SOP
 * TQFP
 * TSOP
 * TO-39

=External Links=


 * Wikihowto: Guide to IC packages