QFN

From bildr

Jump to: navigation, search

Quad Flat No-lead package

Flat No leads packages such as QFN (Quad Flat No leads) and DFN (Dual Flat No leads) physically and electrically connect integrated circuits to printed circuit boards. Flat No leads, also known as MicroLeadFrame, is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat No lead is a near Chip scale package plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB[1]. Flat No lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad[2]. The QFN package is similar to the Quad Flat Package, and a Ball grid array.


References

This page is an Article on bildr. Articles are pages that define or explain a concept, method, or generic item.

Retrieved from "http://wiki.bildr.org/index.php?title=QFN&oldid=7847"

NOTE: All information contained within this article is pure opinion. Although this article is intended to help people, it may contain faulty or misleading information. This article is not to be considered professional opinion or advice, and is in no way a replacement for reading all safety/instructional documentation. Always remember to protect yourself when handling/using hazardous materials, as well as test new techniques before using them on projects/work intended to be handed in or used.

bildr and its contributers take NO responsibility for the information contained within.