Shrink Small-Outline Package
(Redirected from SSOP)

From bildr

Jump to: navigation, search

Shrink small-outline package (SSOP) is a microchip package for surface-mount technology. SSOP chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.025 inches (0.635mm).

Reference

This page is an Article on bildr. Articles are pages that define or explain a concept, method, or generic item.

NOTE: All information contained within this article is pure opinion. Although this article is intended to help people, it may contain faulty or misleading information. This article is not to be considered professional opinion or advice, and is in no way a replacement for reading all safety/instructional documentation. Always remember to protect yourself when handling/using hazardous materials, as well as test new techniques before using them on projects/work intended to be handed in or used.

bildr and its contributers take NO responsibility for the information contained within.